ARM MODULE

ARM SYSTEM ON MODULE & COMPUTER ON MODULE

Computer-On-Modules (COM) are small, ready-to-use computing solutions that usually consist of application-independent hardware and operating system board support packages. Combined with application-specific carrier boards, this results in a wide range of possible uses in professional environments, such as medical technology, industrial automation and robotics, mechanical and plant engineering, and many other areas. The use of COM solutions brings not only rapid and economically efficient development, but also security in the sense of proven and future-proof technology.

Do you have special hardware and software requirements? Together with our established partners we cover the wide range of different form factors in the COM area and support you in the selection, specification and production of your application-specific solutions.

ARM-based

PRODUCT HIGHLIGHTS

SMARC™

Targeted for ARM and x86 specification pin-out definition and designed for use in harsh environments. The SMARC form factor is particularly characterized by its scalable performance and small size. In addition to an extended temperature range, long-term availability is a special feature.

  • Enables mobile, networked embedded solutions
  • Scalable building blocks
  • Pin-out definition optimized for ARM technology
  • Ultra-low power, low-profile solutions
  • Designed for use in harsh industrial environments

  • Form factor 82×50 mm (SMARC 2.1 Short Size)
  • power saving, high performance, cost efficient
  • NXP i.MX8M Plus Quad Cortex-A53
  • Up to 8GB DDR4 RAM and 128GB eMMC
  • Up to 2x LAN, USB, COM, CSI, PCIe
  • HDMI, MIPI-DSI (4 lanes)
  • Low power consumption
  • Yocto Linux BSP, Android, VxWorks

Download Datasheetnext system_SMARC_LEC-IMX8MP_01-2021.pdf 

QSEVEN™

The first commercially successful card edge connector form factor (MXM connector) has evolved over time from a pure x86 solution to ARM support.

  • Qseven® in low-power ARM architecture
  • Specially designed for mobile applications
  • Maximum power consumption of 12 watts – at 5V supply voltage
  • MXM2 card slot connector
  • Legacy-free standard – specialized for fast serial interfaces like PCI Express® and Serial ATA.
  • Compact size with 70×70 mm and μQseven with 40×70 mm
  • Flat design compared to COM Express®

  • 70×70 mm form factor (SMARC 2.1 Short Size)
  • power saving, high performance, cost efficient
  • i.MX 6 Family, single, dual and quad-core processor (ARM Cortex A9), up to 1.2GHz
  • up to 4GB DDR3 onboard memory, and 64GB eMMC and uSD socket
  • LAN, USB, COM, SATA, CSI, PCIe
  • 1 x LVDS Dual Channel or 2 x LVDS Single Channel 18/24 bit interface (resolution up to 1920 x 1200)
  • low power consumption
  • Yocto Linux BSP and Linux support

Datasheet: next system_PQ7-M640F_2021.pdf 

OSM/SOLDER MODULES AND SYSTEMS-ON-MODULES (SOM)

Solder-on modules are small, cost-effective and offer concentrated computing power for visualization, Internet communication and demanding control tasks in mechanical engineering and device technology. As open source hardware and modern software architecture, the solder modules are a perfect building block for the development of secure devices, e.g. in large IoT networks.

  • Complex processor solutions can be realized quickly and easily
  • Complex pin multiplexing and sophisticated DDR4 RAM layout already implemented
  • Short time to market
  • Only one supply voltage (5 V) necessary

  • form factor 30×30 mm
  • power saving, powerful, cost efficient
  • NXP i.MX8M Mini (4x Cortex A53 1.6Ghz and 1x Cortex M4@400 MHz)
  • Up to 4GB DDR4 RAM and 128GB eMMC
  • 1x LAN, 2x USB, 4x UART, GPIO, SDIO, CSI
  • MIPI-DSI (4 lanes)
  • low power consumption
  • Yocto Linux BSP

Download Datasheet: next system_som-sl-i.mx8m-mini-en_06-2020.pdf 

COM-HPC – FOR HIGH PERFORMANCE COMPUTING

The use of standardized Computer-on-Modules in the embedded market has been proven for a long time – the best example is COM Express®, the successful and worldwide leading standard for Computer-on-Modules since 2005.

Today, however, the embedded market is facing new challenges. Applications such as artificial intelligence and the upcoming 5G wireless standard are associated with an enormous hunger for data and require more computing power. This also requires new concepts for embedded computers: existing standards will no longer be sufficient to meet the growing demands of the embedded market.

Leading manufacturers in the industry, such as Kontron, have set up a new working group in the PICMG standardization committee to make the COM standard fit for the future. Computer-On-Modules High Performance Computing – COM HPC – will complement the existing COM Express® standard.

  • Long-term availability
  • High scalability via CPU architectures and technology evolution
  • Future-proof PCIe Gen4/5 and up to 25G Ethernet per lane
  • Cost-optimized cabling/integration
  • Robustness, advanced environmental specification
  • Small form factor in space-constrained applications
  • Industrial-grade connectors

Learn more about the new COM standard: COM-HPC Introduction

Download White paper: next system_kontron_wp_hpc_03-2021.pdf 

  • Size D form factor – 160×160 mm 
  • Intel NextGen HCC (high core count) 
  • Up to 20 cores, processor TDP up to 120W 
  • 32x PCIe Gen 4.0 lanes + 16x PCIe Gen 3.0 lanes
  • Up to 8x LAN Ports for various configurations: 100GbE / 2x 50GbE / 4x 25GbE + 4x 10GbE
  • Memory: Max 512GB DIMM-DDR4 with 4x DIMMs
  • Optional onboard storage NVMe
  • Industrial temperature versions
  • Embedded management controller

PLANNED FOR Q3 /2021

Your individual solution – we have the right modules for it.