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COMPUTER-ON-MODULES

COM BY NEXT SYSTEM

Computer-On-Modules (COM) are small, ready-to-use computing solutions that usually consist of application-independent hardware and operating system board support packages. Combined with application-specific carrier boards, this results in a wide range of possible uses in professional environments, such as medical technology, industrial automation and robotics, mechanical and plant engineering, and many other areas. The use of COM solutions brings not only rapid and economically efficient development, but also security in the sense of proven and future-proof technology.

Are you looking for a suitable x86-based solution for your individual application? With established partners we cover the wide range of different form factors in the COM area and have the right hardware and software for every application. We are happy to support you in the selection, specification and production of your requirement-specific solution.

x86-based

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PRODUCT HIGHLIGHTS

COM EXPRESS®

This standard is the successful further development of ETX® and, in addition to supporting the latest CPU technologies, includes the increasingly important interfaces PEG (PCIexpress graphics), PCIe, SATA and Gigabit Ethernet. In addition to the established scalability in the CPU area, the COM Express™ standard offers a choice of four different sizes.

  • Standardized form factors and pin-outs
  • mini 85×55 mm, compact 95×95 mm and basic 125×95 mm
  • Digital display interfaces (DisplayPort, HDMI)
  • USB 3.0
  • Suitable for industrial use

COM EXPRESS® MINI TYPE 10 WITH INTEL ATOM® X6000E, PENTIUM® AND CELERON® SERIES

  • Form factor 84×55 mm (COM Express® mini)
  • Pin-out Type 10
  • Power-saving, powerful, cost-efficient
  • Single / Dual / Quad Core Atom and Celeron Processor
  • up to 16GB soldered DDR4 ECC RAM and 128GB eMMC
  • LAN, SATA, PCIe Gen 3.0, USB, 2xCOM, LPC, SPI
  • 1GbE (optional 2.5GbE) with TSN support
  • DP++, LVDS or eDP
  • Windows 10, Linux and VxWOrks
  • Industrial Temperature Option (E2) by Design

Download Datasheet: next system_come-mel10_04-2021.pdf

SMARC™

Targeted for ARM and x86 specification pin-out definition and designed for use in harsh environments. The SMARC form factor is particularly characterized by its scalable performance and small size. In addition to an extended temperature range, long-term availability is a special feature.

  • Enables mobile, networked embedded solutions
  • Scalable building blocks
  • Pin-out definition optimized for x86 technology
  • Ultra-low power and low-profile solutions
  • Designed for use in industrial environments

SMARC 2.1 MODULE WITH INTEL ATOM® X6000E, PENTIUM® AND CELERON® SERIES

  • Form factor 82×50 mm (SMARC 2.1 Short size)
  • Power saving, powerful, cost efficient
  • Dual / Quad Core Atom x6000 and Celeron J6000 Processor
  • up to 16GB soldered DDR4 ECC RAM and 128GB eMMC
  • up to 3xLAN, SATA, PCIe Gen 3.0, USB, 2xCOM, LPC, SPI
  • 1GbE with TSN support
  • DP++, HDMI, LVDS or eDP
  • Windows 10, Linux and VxWOrks
  • Industrial Temperature Option (E2) by Design for selected SOCs

Download Datasheet: next system_smarc-sxel_09-2020.pdf

QSEVEN™

The first commercially successful card edge connector form factor (MXM connector) has evolved over time from a pure x86 solution to ARM support.

  • Qseven® in low-power x86 architecture
  • Specially designed for mobile applications
  • Maximum power consumption of 12 watts – at 5V supply voltage
  • MXM2 connector
  • Legacy-free standard – specialized for fast serial interfaces like PCI Express® and Serial ATA
  • Compact size with 70 x 70 mm and μQseven with 40×70 mm
  • Flatter design compared to COM Express®

Qseven® Size Module with Intel Atom® E3900 Series, Pentium™ N4200 or Celeron™ N3350 Processor

  • Form factor 70×70 mm (Qseven standard module size)
  • Power saving, powerful, cost efficient
  • Single / Dual / Quad Core Atom E39xx and Celeron / Pentium N processor
  • up to 8GB soldered DDR4 RAM and 64GB eMMC
  • 1x GbE LAN, SATA, PCIe Gen 3.0, USB, COM, LPC, SPI, MIPI CSI, GPIO
  • DP++, HDMI, LVDS
  • Windows 10, Yocto Linux
  • Industrial Temperature Option (E2) by Design for selected SOCs

Datasheet: next system_Q7-AL_06-2017.pdf

COM-HPC – FOR HIGH PERFORMANCE COMPUTING

The use of standardized Computer-on-Modules in the embedded market has been proven for a long time – the best example is COM Express®, the successful and worldwide leading standard for Computer-on-Modules since 2005.

Today, however, the embedded market is facing new challenges. Applications such as artificial intelligence and the upcoming 5G wireless standard are associated with an enormous hunger for data and require more computing power. This also requires new concepts for embedded computers: existing standards will no longer be sufficient to meet the growing demands of the embedded market.

Leading manufacturers in the industry, such as Kontron, have set up a new working group in the PICMG standardization committee to make the COM standard fit for the future. Computer-On-Modules High Performance Computing – COM HPC – will complement the existing COM Express® standard.

  • Long-term availability
  • High scalability via CPU architectures and technology evolution
  • Future-proof PCIe Gen4/5 and up to 25G Ethernet per lane
  • Cost-optimized cabling/integration
  • Robustness, advanced environmental specification
  • Small form factor in space-constrained applications
  • Industrial-grade connectors

Learn more about the new COM standard: COM-HPC Introduction

Download White paper: next system_kontron_wp_hpc_03-2021.pdf

  • Size D form factor – 160×160 mm 
  • Intel NextGen HCC (high core count) 
  • Up to 20 cores, processor TDP up to 120W 
  • 32x PCIe Gen 4.0 lanes + 16x PCIe Gen 3.0 lanes
  • Up to 8x LAN Ports for various configurations: 100GbE / 2x 50GbE / 4x 25GbE + 4x 10GbE
  • Memory: Max 512GB DIMM-DDR4 with 4x DIMMs
  • Optional onboard storage NVMe
  • Industrial temperature versions
  • Embedded management controller

PLANNED FOR Q3 /2021

ETX®

Even 20 years after its market introduction by JUMPtec, now Kontron, this established COM standard is still maintained by some manufacturers. However, for a redesign we recommend to use one of the current COM standards.

  • x86 architecture
  • Footprint 95×114 mm
  • Single/ Dual/ Quad Core Atom and Celeron Processor
  • Intel® Atom™ over AMD up to Intel® Core™2 Duo on 95×114 mm.
  • Long-term support for ETX until well after 2025

ETX Module with Intel Atom® Processor E3800 Series SoC

  • Form factor 114×95 mm (ETX Rev. 3.02)
  • Power saving, powerful, cost efficient
  • Single / Dual / Quad Core Atom and Celeron Processor
  • up to 8GB DDR3L RAM
  • LAN, PATA or SATA, PCI, 16 Bit ISA, USB, COM, PS/2
  • VGA, LVDS
  • Windows 7/8 32 Bit, Linux 32/64 Bit
  • WES7/8, WEC7/8, VxWorks

Datasheet: next system_ETX-BT_01-2019.pdf

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